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High Frequency Transistor
Ceramic Transistor Package
Part Number:

RF Power Transistors
2SC Series
2N/3DA/3DG/3DK Series
AGR/AM/BFQ/BLU Series
BLV/BLW/BLY/BLX Series
CD/HXTR/MRA/MRF Series
MRW/MS/MSC/NE Series
PT/PTB/SD Series
TP/TPV/TPW Series
Other Series
RF Power Transistors Package
Screw Cooling Structure
Flat Cooling Structure
Ceramic Cooling Structure
Product HomeProductCeramic Transistor Package
Ceramic Transistor Package
All high frequency transistor packages are developed and produced by ourselves. We can customize ceramic package for users’ requirements and applications totally on our own. We have sufficient inventory for frequently used ceramic package.
 
Ceramic packages HG produced are categorized according to different cooling structures:

  Copper screw cooling structure
  Copper flat cooling structure
  Ceramic base cooling structure

 

 

Some schematic diagram of ceramic packages we produce are as follows:

 

 

 

 

 

 

 

 

 

 

 

 

 

 

HG Semiconductor Co., Ltd. Copyright 2016. All Rights Reserved. ICP number: 11030609
Address: West 2nd Floor, 2# Buliding, 88 Qianyao Road, Wuxi, Jiangsu, China
Tel: +86-510-81023902 +86-755-61285520  Fax:+86-510-81023909