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High Frequency Transistor
Ceramic Transistor Package
Part Number:

RF Transistor
2SC Series (Toshiba, MIT)
BLF Series (NXP, Philip)
D*UK/DMD Series (SemeLAB)
DU Series (MA-COM)
MS Series (Mircorsemi, APT)
VRF Series (Mircorsemi, APT)
Other Series
HOT Sales
RF Transistor Package
Screw Cooling Structure
Flat Cooling Structure
Ceramic Cooling Structure
Product HomeProductCeramic Transistor Package
Ceramic Transistor Package
All high frequency transistor packages are developed and produced by ourselves. We can customize ceramic package for users’ requirements and applications totally on our own. We have sufficient inventory for frequently used ceramic package.
Ceramic packages HG produced are categorized according to different cooling structures:

  Copper screw cooling structure
  Copper flat cooling structure
  Ceramic base cooling structure



Some schematic diagram of ceramic packages we produce are as follows:















WUXI Huago(HG) Semiconductor Co., Ltd.(无锡市华高微电子有限公司) Copyright 2016. All Rights Reserved(版权所有). ICP number(ICP 编号): 苏ICP备11030609号
Address:6th Floor, 20# Building, 53 Xiuxi Rd, Binhu District, Wuxi, Jiangsu, China; Postcode: 214122
Tel: +86-510-81023902 +86-755-61285520  Fax:+86-510-81023909