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MOSFET ESD Controls
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MOSFET ESD Controls HomeQuality ControlMOSFET ESD Controls
 

Electrostatic Discharge (ESD) Controls

The structure of semiconductors makes them extremely sensitive to static electricity. At HG SEMICONDUCTOR, we design our integrated circuits to be as resistant to static electricity as possible. We also take extensive measures to reduce static electricity throughout the manufacturing process.

Examples of Procedures to Control ESD

 

Wafer Process

Assembly Process

Test Process

Floors

Use antistatic flooring materials with a surface resistance of 1x105 to 1x1010Ω or antistatic mats

Bench tops

Use work surfaces with a surface resistance of 1x105 to 1x1010Ω

Chairs

Use chairs with a resistance to ground of 1x105 to 1x108Ω

Carts 
(When carrying products without static electricity protection)

Wafer charge voltage: Use of 
carts with charge voltage 
controlled to less than ±300V

Apply antistatic mats to shelves and ground to floor 
(resistance to ground of 1x105 to 1x1010Ω)

Storage shelves

Store wafers in box. Shelves 
are either grounded or have 
charge voltage of less than 
20kV.

Use grounded shelves with a surface resistance of 1x105 to 1x1010Ω

Work clothes, 
dust proof clothes

Wear antistatic clothes with surface resistance of 1x105 to 1x1011Ω

Shoes

Antistatic shoes that meet the following specification: Surface resistance of 1x105 to 1x1010Ω

Wrist strap

-

Straps that meet the following specification: Resistance to 
ground of 1x105 to 1x107Ω

Finger stalls

-

Use stalls that meet the following specification: Surface 
resistance of 1x105 to 1x1010Ω

Gloves

Use gloves made from materials that are charge resistant. Surface resistance of 1x105 to 1x1011Ω

Equipment

For electrically powered equipment, use grounded equipment

HG Semiconductor Co., Ltd. Copyright 2016. All Rights Reserved. ICP number: 11030609
Address:6th Floor, 20# Building, 53 Xiuxi Rd, Binhu District, Wuxi, Jiangsu, China; Postcode: 214122
Tel: +86-510-81023902 +86-755-61285520  Fax:+86-510-81023909