Sitemap | 中文版
HomeAbout usProductApplication CasesQuality ControlPlace an OrderDownloadContact us
Quality Control Programs
Product Reliability Test
Product Failure Analysis
Quality & Reliability Support
MOSFET ESD Controls
Part Number:

RF Power Transistors
2SC Series
2N/3DA/3DG/3DK Series
AGR/AM/BFQ/BLU Series
BLV/BLW/BLY/BLX Series
CD/HXTR/MRA/MRF Series
MRW/MS/MSC/NE Series
PT/PTB/SD Series
TP/TPV/TPW Series
Other Series
RF Power Transistors Package
Screw Cooling Structure
Flat Cooling Structure
Ceramic Cooling Structure
Product Reliability Test HomeQuality ControlProduct Reliability Test

Engineering Tests

At the early stage of pilot production, reliability assessments are performed as necessary.

Moisture Sensitivity Level

In general, when resin components of plastic packages that have absorbed moisture are subjected to heat stress during mounting, cracks can develop in the packaging. For plastic surface mount devices, we examine each package configuration and the individual components that constitute packages, and perform moisture-induced stress sensitivity tests as necessary. Based on the results of these assessments, packages are classified by moisture sensitivity, and customers are notified of recommended mounting conditions to counter heat stress during mounting.

Production Qualification Tests

Because the characteristics of newly manufactured components, as well as combinations of components, may affect reliability, we conduct production qualification tests (reliability evaluation) on representative products.

Reliability Test Items

Test

Reference
Standard

Conditions

Duration

Sample Size

High Temperature Test

/

Plastic/Ceramic Pack.125 

/

100%

     Metallic  Pack.150

Thermal Resistor Test

/

Rth=VBE/2*Pc

/

100%

High Temp Storage Life

GB4937.3

150

168h/1000h

50

Electrical Endurance

GB4938

T­case = 75

168h/1000h

30

High Humidity High Temp Cycling

GB2423.4

2595%RH, 

12h, 6cy

30

5595%RH

High Humidity High Temp

GB4937.3

Ta=85, 85%RH

168h

30

Temperature cycling

GB4937

-55~+150

5~10cy

30

Highly Accelerated stress test

GB4937

130 85%RH

96h

30

High Temp Storage Life

GB4937.3

150

24h/168h/1000h

50

Intermittent Operational Life

G-003

Load few W on device Tcase = 85on 1min, off 2-3 min

5000cy

30

 

Screening

Even though ensuring quality at each stage of the production process and a range of tests and inspections eliminate most causes of failure, it is possible that some may persist. HG SEMICONDUCTOR's reliability screening eliminates potential early faults. Conducted prior to shipping, it involves the application of stress at a level that will not damage the product in question.

Burn-In

Burn-in is effective as a reliability screening to reject the early failures. In our factories, we strive for improvement in the everyday quality of our products. When the burn-in failure rate has been reduced to a certain level, we reduce the time required for burn-in, and eventually, eliminate it all together. Even after burn-in has been eliminated, products will be periodically sampled for burn-in to assure product quality.

Reliability Monitoring Tests

Once mass production begins, products are periodically monitored to confirm the uniformity of quality and reliability. Tests to monitor reliability are performed on representative samples from each production line.

HG Semiconductor Co., Ltd. Copyright 2016. All Rights Reserved. ICP number: 11030609
Address: West 2nd Floor, 2# Buliding, 88 Qianyao Road, Wuxi, Jiangsu, China
Tel: +86-510-81023902 +86-755-61285520  Fax:+86-510-81023909